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Sunmide® LH-210
Sunmide® LH-210
Sunmide® LH-210
Sunmide® LH-210
Epoxy Curing Agents and Modifiers
Sunmide LH-210 curing agent is a modified Imidazole designed for use as a latent curing agent for epoxy resins.
Category:Hardener

PERFORMANCE ADVANTAGES

• Modified Imidazole for low temperature and quick cure. 

• Can be used as a sole curing agent or as a DICY accelerator.

• Long latency.


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APPLICATIONS

• Prepreg for composite.

• 1 K structural adhesives.

• Potting / Encapsulation in electrical and electronic application 


STORAGE LIFE

At least 24 months from the date of manufacture in the original sealed container at ambient temperature. Store away from heat and excessive humidity in tightly closed containers. 


HANDLING PRECAUTIONS

Refer to the Material Safety Data Sheet for Sunmide LH-210 curing agent


TYPICAL PROPERTIES
AppearanceLight Yellow Powder
Softening point (°C)135
Particle size (um, D50)5.8
Particle size (um, D90)11.2
Specific Gravity @ 25°C1.120
Recommended use level* (phr, EEW=190) 10-25

* : sole cure agent 


TYPICAL FORMULATION (Sole cure)
Epikote 828 (EEW=190)100
Sunmide LH-21010-25
Fumed Silica1


TYPICAL FORMULATION (Accelerator)
Epikote 828 (EEW=190)100
Dicyanex 1400B (DICY)6
Sunmide LH-2101-5
Fumed Silica1

TYPICAL PERFORMANCE*
Latency (at 25C, double initial viscosity)
10 phr> 3 months
15 phr 3 months
20 phr6 weeks
25 phr3 weeks


Lap Shear Strength (MPa)
10 phr 19.6
15 phr 17.0
20 phr 18.0
25 phr 18.5


* Formulation : Epikote 828 / Sunmide LH-210 = 100 / 10-25  Curing schedule for LSS : 150C  for 1 hr